D+T Microelectrónica A.I.E. is an Association of Economic Interest in charge of the commercial exploitation of IMB-CNM’s Clean Room. Its mission is providing the microelectronics industry with turnkey solutions.
The Spanish National Research Council (CSIC) is its majority partner and its industrial partners are: Mondragón Componentes S. Coop, Biosystems S.A., Agbar (Sociedad General de Aguas de Barcelona S.A.) and Alter Technology Ventures, S.L.
We put our facilities and our expertise at your service. We can run single processes in order to test and optimize your technologies, fabricate and characterize prototypes to study feasibility of your new ideas or managing pilot series and/or final production of your devices.
Our experience spreads in different markets, from Industrial and quality control to healthcare and medical technology, from big science experiments to space applications.
You are welcome to carry out your own project sharing your tasks with us!
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The Integrated Clean Room for Micro and Nano fabrication (SBCNM) is a Large Scale Facility (ICTS) dedicated to the development and application of innovative technologies in the field of Nano and Microelectronics.
Since 2014, the ICTS-SBCNM is one of the three nodes of the MICRONANOFABS ICTS Network, the Large Scale Facility supported by the Spanish Ministry of Science and Innovation (MICINN), together with the Clean-Room from ISOM-UPM and the one from NTC-UPV.
The SBCNM is 1500 m2 large, class 100/1000 (ISO 5/6) (plus 4500 m2 for its services), has more than 150 high-tech instruments inside and is complemented with other 350 m2 of back-end and electrical characterisation laboratories.
Product-specific quality standards have been established in the past for customers in the medical technology and space industries.
You can use our production services to fully develop and/or fabricate your product or running single processes to test your own technologies and verify their quality.
In the main Clean Room of IMB-CNM are mainly processed silicon wafers of 100 mm, even though other wafers of different materials and sizes can be processed on demand. Processes availbles are PVD, LPCVD, PECVD, CVD, thermal oxidation, dry etching (RIE, DRIE), photolithography, wet chemical processes, ion implantation, metallization (sputtering, evaporation). You can find more information in the IMB-CNM (CSIC) web page or contacting us.
Shadow Masking Metallization
Selective deposition of thin (up to 10 microns) metal layers (Cu, Al, Ti, Ni, etc.) by evaporation or sputtering, using the shadow-masking technique («dry» process avoiding photolithography). Used, for example, for remetallization of Al pads in power devices, metallization of Al pads in transducers, definition of pads and tracks in ceramic substrates, metallization of piezoelectric substrates, etc.
Under Bump Metallization
We offer UBM technology based on electroless Ni/Au coating on Al pads with diameter 90 µm or 150 µm. It is suitable for flip-chip connections with Sn/Ag bumps.
Techniques available are:
The main activities of this area are addressed towards:
Dicing silicon wafer and substrates of different materials using blades dicing with Semiautomatic machines or cleaving with a LatticeAx 420 Cleaving equippment.
Packaging of microelectronic devices by means of manual fine wire Wedge Bonders and manual heavy wire Wedge Bonder.
D+T Microelectrónica commercial activity is based on the research activity carried out at IMB-CNM, CSIC by its researchers (today almost 80) since 1990.
During the years, the technologies that reached succesfully the application goal and their fabrication repeatibility, became the starting points for the development of new ones and they are today the basis of our costum-made products and technologies development.
Have a look at what we do to be inspired developing your devices.
The laboratories are equipped with measurement and analysis technologies and set-up useful for physically and electrically characterization of devices and systems. You can hire our characterization and analysis services as part of your technology development or production order as well as independently, to test your own samples and verify their quality.
CONTACT US TO HIRE A SERVICE OR TO BOOK AN INSTRUMENT AND A SPECIALIZED OPERATOR ON AN HOURLY BASES
In the laboratories at IMB-CNM are available many instruments with the purpose of performing:
Advanced measurements based on optical methods (Infrared and thermoreflectance thermography, internal infrared lased defection) have been set-up for a precise electro-thermal characterization at chip or system level. Lock-in approach applied to infrared thermography allows the analysis of the reliability limits of advanced power systems and devices (high temperature, Wide Band Gap). Applications:
Instrumentation in the Clean-Room and anexed laboratories allow for:
Our Reverse Engineering Service experts have deep knowledge in semiconductor technology, fabrication processes and IC design, which combined with the acces to the high-end IMB-CNM’s Clean Room equipment, allows us to offer a wide range of in-chip analysis related services, including:
Read more in the Reverse Engineering Laboratoy web page and contact us to get more information.
D+T Microelectrónica offers its products and services to the scientific research communities as well as to the industrial companies that need or want to develop their own innovative microelectronics solutions to face present and future human challegies.
Our clients are working hard in:
WHICH IS YOUR CHALLENGE? CONTACT US TO KNOW HOW WE CAN HELP YOU
SiC diodes and transistors for high temperature range environment.
Photodiodes for solar tracking systems.
Bio and Chemical sensors for agriculture and food industry.
Printed electonics for industrial or informatic control.
Bio and Chemical Sensors for healtcare industry.
Radiation Detectors for medical imaging, dosimetry or microdosimetry.
Organ-On-Chip for medical research.
Particle Detectors and Instrumentation for Nuclear and High Energy Physics Experiments,
Photodiodes for Syncrotron X-ray beam monitoring.
