1000 m² of total surface. House in house structure. Class 100-10,000 depending on areas. Air control (T= 21ºC±1ºC) and humidity (40%±5%). D.I. water system (18 Mohm.cm) 28 m³/day, maximum flow: 1.6 m³/hour. Ultrapure gas distribution. Power supply: 25 kV and 3000 kVA. Waste treatment. Security system: gas detectors, fire and intruder protection.

Person responsible/contact: Ferran Xinxó (ferran.xinxo@cnm.es)

CLEAN ROOM EQUIPMENT
 

1.- Thermal processes and CVD equipment
			11 tubular furnaces for oxidation, annealing and diffusion thermal processes 3 LPCVD furnaces for poly and nitride deposition 2 PECVD furnace for passivation layer deposition (oxide and nitride) 1 APCVD furnace for doped oxide deposition.

 

2.- Ion Implantation equipment
			1 medium current implanter for B, P, As, N and Ar

 

3.- Metallisation equipment
		1 DC magnetron sputtering, manual loading, 1 cathode 1 DC/RF sputtering, automatic loading, 4 independent cathodes 1 Sputtering with 3 independent cathodes, automatic loading 1 Sputtering with 3 independent cathodes, manual loading 1 Sputtering with 1 DC cathode, manual loading

 

4.- Photolithographic equipment
			1 5:1 Stepper 0.8 µm resolution 1 5:1 Stepper 0.5 µm resolution Contact/proximity mask aligner Double side contact/proximity mask aligner 2 automatic tracks for photoresist deposition and developing Mask cleaner Manual spinner for photoresist deposition Critical dimension measurement system

 

5.- Dry etching equipment
			1 manual RIE, one chamber 1 hexode RIE 1 automatic RIE with 4 chambers for Al, oxide, poly, nitride etching and photoresist removal 2 plasma barrels

 

6.- Wet etching and cleaning equipment
			10 semiautomatic wet benches 4 spinners for wafer rinse/drying 1 bench for anisotropic etching

 

7.- In-line test equipment
			2 inspection microscopes 1 sheet resistance measurement system 1 profilemeter 1 optical interferometer for dielectric thickness measurement 1 Ellipsometer 1 FT-IR spectrometer