| The
main actions of this service are addressed towards: - Reverse
engineering characterisation
- Physical
characterisation with electric methodology (Spreading Resistance)
-
Package of microelectronic devices
|
Person
responsible/contact: Salvador Hidalgo
(salvador.hidalgo@cnm.es)
EQUIPMENT
AVALIABLE
Reverse
engineering. Physical characterisation- Spreading
Resistance measurement system
- Scanning
Electron Microscope (SEM)
- Automatic
polishing machine with multisample head
- Automatic
polishing machine with two heads suitable for microsections
- Polishing
machine for Spreading Resistance samples preparation
- Diamond
saw
- 2
optical microscopes (with micromeasurement equipment)
- Photomicroscope
- Plasma
equipment for plastic and layer decapping
Laser
level technique for mechanical stress measurement
Packaging- Automatic
saw for dicing
- 2
wedge bonding machines
- SMD,
flip-chip
and die bonding equipment
Contact: