AVAILABLE PROCESSES Wet and dry oxidations Ion implantation of B, P, As, N and Ar Diffusion (several ambients) CVD (Nitride, Polysilicon, Oxide, BPSG) Metallisation (Al-Si, Al-Cu, Al-Si-Cu, TaSi, Ti, Ni, Au) Polyimide deposition Wet and dry etching Surface and bulk silicon micromachining Anodic bonding Packaging (Die bonding, Wire bonding, SMD) In line test (Ellipsometer, Optical interferometer, Profilemeter, Four-needle probe) Photolithography (Proximity, Step and repeat, Double side)
			Contact: Dt@cnm.es